有机发光塑料的制备及表征
摘要：传统点涂法制备的LED器件具有出光效率低，芯片易升温致发光效率低，有机荧光转换材料远程封装芯片可有效弥补这些缺陷。利用物理混合法将YAG:Ce荧光粉混合于DGEBA树脂中，采用高温固化法将基体树脂固化交联制成有机荧光转换材料。对样品进行荧光性能、力学性能和耐热性能等方面的测试。SEM显示大部分荧光粉均匀分布在基体树脂中。荧光光谱测得激发峰在345nm和468nm处各有一个，与YAG:Ce的激发峰位置基本一致。荧光光谱图显示5wt%荧光粉的有机荧光转换材料的荧光相对强度最强。DSC分析样品的玻璃化转变温度为124℃，具有良好的耐热性。结果表明有机荧光转换材料可用于远程封装蓝色芯片制备白光LED。77946
毕业论文关键词：白光LED；物理混合法；DGBEA树脂；YAG:Ce；有机荧光转换材料
Preparation and Characterization of Organic Light - emitting Plastics
Abstract：The traditional LED coating device has the disadvantages of Low efficiency of light and low efficiency of the chip。 The chip is packaged remotely by organic fluorescent conversion materials which can effectively compensate for these defects。 The YAG: Ce phosphor was mixed with DGEBA resin by physical mixing method, and the matrix resin was cured and crosslinked by high temperature curing method to form organic fluorescent conversion material。 What were tested which are the fluorescence performance, mechanical properties and heat resistance of the samples。 SEM shows that most of the phosphor is evenly distributed in the matrix resin。 The excitation peaks were measured at 345 nm and 468 nm, respectively, which was consistent with the excitation peak position of YAG: Ce phosphor。 The fluorescence spectra showed that the fluorescence intensity of the organic fluorescent conversion material with the phosphor content of 5wt% was the strongest。 The Tg of the sample is 124℃ by using DSC analysis, and the film had good heat resistance。 The results show that organic fluorescent conversion materials can be used to remotely encapsulate blue chips for the preparation of white LEDs。
Keywords: white LED；physical mixing method；DGEBA resin；YAG: Ce；organic fluorescent conversion materials
目 录
1文献综述 1
1。1白光LED 1
1。2发展趋势 2
1。3有机材料基体 2
1。3。1硅树脂作基体 2
1。3。2环氧树脂改性有机硅树脂作基体 3
1。3。3聚碳酸酯作基体 3
1。3。4环氧树脂作基体 3
1。4选题依据 6
1。5立题目的和意义 6
1。6研究内容和目标 6
1。6。1研究内容 6
1。6。2研究目标 6
2实验部分 7
2。1实验试剂及仪器 7
2。2有机荧光转换材料的制备 7
2。3分析表征 8
2。3。1傅立叶红外光谱仪 9
2。3。2荧光光谱仪 10
2。3。3扫描电子显微镜（SEM） 11
2。3。4万能材料实验机 12
2。3。5示差扫描热量仪（DSC）