纳米SiC改性环氧树脂的研究
碳化硅是类无机化合物，它为优良的半导体材料，碳化硅在无杂质时呈现出透明，无色的六方晶体的形貌。工业生产时用到的碳化硅由于含其他物质而呈现黑、灰、绿等颜色。碳化硅在很多方面表现优异，例如禁带的宽度比一般的半导体材料要宽、传热的效率高、热力学的稳定性好、在空气中不易被氧化及不易被酸碱腐蚀等。相比于常规碳化硅，纳米碳化硅材料具有不同寻常的物理性能并且使用范围广泛。使用纳米碳化硅微粒对其进行表面改性是提高纳米碳化硅微粒与环氧树脂复合材料的力学能力一种有效方法。本文使用的KH-550（γ-氨丙基三乙氧基硅烷）是一种在生产在经常使用到的表面改性剂，它可以在所需改性物的表面上形成单分子膜层，并提高它们的分散性和润湿性。本论文使用纳米碳化硅（SiC）微粒通过一种硅烷偶联剂KH-550表面改性后，再通过共混成形法来制备碳化硅/环氧树脂（SiC/EP）复合材料，从而获得具有很好力学性能的聚合物复合材料。在本次实验中，通过使用KH-550改性的碳化硅颗粒能显著提升其在环氧树脂中的分散程度，由此增强碳化硅/环氧树脂复合材料力学性能。碳化硅的表面改性情况分别通过傅里叶红外光谱仪（IR），X射线衍射仪（XRD），扫描电镜（SEM）进行表征。实验表明，KH-550和碳化硅之间形成了化学键，并且在碳化硅的表面上形成了有机单分子膜。
毕业论文关键词 环氧树脂；固化剂；纳米碳化硅；硅烷偶联
Abstract A method of using epoxy resin as more organic polymers, it refers to a two or more polymer containing epoxy groups。 In general, low molecular weight epoxy resin。 Epoxy resin has good electrical insulation, mechanical ability and adhesive properties of other types of composite materials and their use in the variability is unmatched by other plastics。 So it is widely used within the scope of people composites, coatings, casting materials, etc。, and play a major role in daily life or production。
Silicon carbide (SiC) is an excellent semiconductor material, silicon carbide in the absence of impurities exhibits transparent, colorless hexagonal crystal morphology。 When industrial production due to the use of silicon carbide containing other substances presented black, gray, green and other colors。 Silicon carbide outstanding performance in many aspects, such as the band gap width than the average width of the semiconductor material to high heat transfer efficiency, thermodynamic stability, not easily oxidized in air and difficult to be acid corrosion。 These features make it can be used in high-temperature, high-frequency, high-power conditions and other harsh environments。 Compared to conventional silicon carbide, silicon carbide nano-materials have unusual physical properties and the use of a wide range。 Nano-silicon carbide particles using its surface-modified nano-particles and silicon carbide mechanical ability epoxy composites is an effective way to improve。 As used herein, KH-550(γ-aminopropyl triethoxysilane) is a frequently used in the production of surface modifier, which may be formed on the surface of the monomolecular film desired modified -and improve their dispersion and wettability。 After this paper, the use of nano-silicon carbide (SiC) particles by a silane coupling agent KH-550 surface-modified, and then to prepare silicon carbide/epoxy (SiC/EP) composites by blending molding, thereby obtaining a good mechanical properties of polymer composites。 In this experiment, by using KH-550 modified silicon carbide particles can significantly improve its degree of dispersion in epoxy resin, thereby enhancing the silicon carbide/epoxy composite mechanical properties。 Surface modification by the case of silicon carbide, respectively, Fourier transform infrared spectroscopy (IR), X-ray diffraction (XRD), transmission electron microscopy (TEM) were characterized。 Experiments show that the formation of a bond between the KH-550 and silicon carbide and silicon carbide is formed on the surface of organic monolayers。
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