摘要长久以来，温度和湿度都是环境测量中的重要参数，对于人们的日常生活有着非常重要的意义。传统的温湿度检测，尤其是设备之间需要通过大量的电缆连接。不仅布线困难，而且电缆易受外界腐蚀和其他影响。这种测量方法不仅复杂且经济成本高昂。因此，基于无线传感技术的温湿度检测的出现很好地解决了这个问题。68296

论文着重介绍了温湿度检测系统的分析设计，详细介绍分析了温湿度传感模块的工作原理，采用MSP430单片机进行数据采集并利用无线传感技术进行数据收发，实现了实验结果的可视化。在此基础上，简要介绍了结构健康监测以及压电传感器的基本原理，设计了电荷放大器对压电传感器的输出进行整形放大并利用温湿度测量系统完成了对不同温度下压电传感器的实验测试,验证了温度对压电陶瓷传感器的影响。

毕业论文关键词  温湿度测量  无线传感技术  MSP430  电荷放大器  压电陶瓷  结构健康监测      

毕业设计说明书（论文）外文摘要

Title    The Design of Temperature and Humidity Monitoring  System Based on MSP430 and NRF24L01                                                  

Abstract

Temperature and humidity are important parameters in environmental measuring through the ages. A large number of cables are needed in the traditional temperature and humidity test, especially those are controlled through the long distance. The cable wiring is complicated and is susceptible to corrosion and other effects. As a result, the presence of the temperature and humidity detection based on wireless sensor technology solved the problem very well.

The paper emphatically introduces the design and analysis of the temperature and humidity detection system, analyzes the working principle of temperature and humidity sensor module, uses MSP430 MCU for data acquisition and wireless sensing technology for data transceiver and realizes the visualization of the results finally. On this basis, the paper introduces the structural health monitoring briefly and the basic principle of piezoelectric sensor, designs a charge amplifier to enlarge the output of the piezoelectric sensor. At the same it is completes the experiment of piezoelectric sensor of temperature by using the temperature and humidity measurement system and the influence of temperature on piezoelectric sensor is finally validated.

Keywords  Measurement of Temperature and Humidity  WSN  MSP430  Charge Amplifier  Piezoelectric Ceramics  Structural Health Monitoring      

目   次

1 引言 1

1.1 课题研究背景 1

1.2 基于无线传感技术的温湿度测量及其应用 1

1.3 本文研究内容 3

2 系统温湿度传感器选择 4

2.1 温湿度监测系统的简要介绍 4

2.2 温湿度模块DHT11 4

3 系统的硬件设计 8

3.1 系统硬件的整体设计 8

3.2 系统硬件芯片的选择 8

3.3 部分电路设计 10

4 系统软件部分设计 13

4.1 单片机数据采集程序设计