摘要随着电镀技术的进展，工艺参数对钢铁带材镀铜性能的影响成为的研究热点，这一领域的开发将使镀铜带材的应用范围大大拓展。电镀铜层有非常好的特性，比如高强度耐磨性，抗腐蚀性质。可以沉积的金属及合金品种远多于化学镀。价格比化学镀低得多。工艺比较成熟，镀液简单、易于控制。在总结前人工作的基础上，对基体的前处理工艺、镀液的组成及配比，电镀工艺条件等进行了详细的研究。通过对镀层性能和抗腐蚀能力等方面的检测 ，结合机理的分析，得出以下实验结论：

通过查阅大量资料和前期探索试验,改进了镀液组成,获得最佳镀液为:

硫酸铜(CuSO4·5H2O):200g/L,硫酸(H2SO4):50g/L,氯离子20-40g/L,对影响电镀铜的工艺条件：温度，时间，ＰＨ，电流的大量试验研究。在此基础上,通过正交设计试验和其结果的分析得出了最佳工艺条件为:镀液温度:２５℃ ；电镀时间:20min ；pH值为６。镀层性能测试显示:镀层与基体之间结合力良好；镀层细致、均匀、平整、无任何漏镀,而且不仅有很好的实用性，而且还有的装饰性。69786

毕业论文关键词：电镀铜；钢铁带材；硫酸铜

 Abstratct With the progress of electroplating technology, the influence of process parameters on the copper plating performance of steel strip has become a hotspot, and the development of this field will greatly expand the application of copper strip. Electroplated copper layer has very good characteristics, such as high strength wear resistance, corrosion resistance. Can be deposited more than the metal and alloy varieties more than electroless plating. The price is much lower than the chemical plating. The process is more mature, the bath is simple, easy to control. On the basis of summarizing the predecessors' work, the pretreatment process, the composition and the ratio of the plating solution and the plating process conditions were studied in detail. Through the analysis of coating performance and corrosion resistance and other aspects of the test, combined with the following conclusions:

Through the access to a large number of data and pre-exploration test, improved bath composition, get the best bath:

Copper sulfate (CuSO4 · 5H2O): 200g / L, sulfuric acid (H2SO4): 50g / L, chloride ion 20-40g / L, the impact of copper plating process conditions: temperature, time, PH, current a large number of experimental study. On the basis of this, the optimum technological conditions were obtained by orthogonal design experiment and its result analysis: the bath temperature: 30 ℃; plating time: 20min; pH value was 6. Coating performance tests show that the coating between the coating and the substrate is good; the coating is fine, uniform, smooth, without any leakage, and not only has good practicality, but also decorative.

Key words: Electroplating copper; steel strip; copper sulfate.

目 录

引言1

正文1

1电镀铜概述1

    1.1.1电镀铜技术1

    1.1.2电镀铜的发展趋势3      

    1.2 化学镀Ni-Co-P三元合金 5

   1.2.1 Ni-Co-P三元合金化学镀理论基础5　 

   1.2.2 Ni-Co-P合金化学镀层的应用以及现状 11　　　　　

     1.3 选题意义以及主要工作内容15

二、2.1工艺参数镀液组分以及热处理对镀层的影响17

 2.1.1前处理的影响17

  2.2施镀工艺的影响19

 2.2.1pH值的影响19

 2.2.2温度的影响22

  2.3镀液组成的影响25

  2.3.1c(H2PO2)对沉积速度的影响25

三、正交设计实验  26

3.1正交试验的设计表及评分标准26