摘要本篇论文主要讲了运用 ANSYS 软件模拟 CCGA 器件的结构变化，并分析 CCGA 器件的应力应变以及蠕变在不同尺寸参数和不同焊柱材料下的变化。通过模拟实 验，并分析实验结果的得到结论，CCGA 结构的应力应变、蠕变以及位移量等等 的发生区域。应力应变的主要集中区域在焊柱与陶瓷载体以及焊柱与基板的焊接 处。蠕变变化最严重的区域基本也都是在与陶瓷载体以及基板相焊接的焊柱上。 CCGA 整体模拟结构的位移呈现一种不和谐的状态，它的焊柱和陶瓷载体上的位 移呈现的是越往 X 轴正方向的位移量越大，而基板的位移量却是呈现一种中间大 两边小的状态。在变换不同的焊柱尺寸之后又进行了结构模型的模拟，模拟结果 显示焊柱直径对 CCGA 整体结构有很大的影响。增大焊柱直径的同时，结构的 Mises 应力也跟着变大，减小焊柱直径，结构的 Mises 应力也减小。之后又研究 了不同焊柱材料对 CCGA 结构性能的影响。得到结论，在一低范围之内，弹性模 量越小的材料在试验中表现出来的性能越好，越适合作为 CCGA 器件的焊柱材料。73871

毕业论文关键词：CCGA 有限元 结构优化

The design of CCGA device on structure optimization

Abstract This paper mainly talks about the structural changes of the CCGA device using ANSYS software, and analyzes the stress and strain of the CCGA device and the changes of the creep in different size parameters and different welding column materials。 Through the simulation experiments, and analysis of the results of the experiment, the stress and strain, creep and displacement of the CCGA structure are analyzed。 The stress and strain are mainly concentrated in the welding column and the ceramic carrier as well as the welding position of the welding column and the base plate。 The most serious area of creep is also the basic of the ceramic carrier and the base of the substrate。 CCGA overall simulation structure displacement presents a state of disharmony and its welding column and ceramic carrier displacement is more to the X axis is the direction of displacement of the greater, and displacement of the substrate is presented a small both sides of the intermediate state。 The structure model is also carried out after changing the size of the welded column。  The simulation results show that the diameter of the welding column has a great influence on the overall structure of CCGA。 At the same time, the Mises stress of the structure also increases with the increase of the diameter of the column, and the Mises stress of the structure is also reduced。 Then, the effect of different materials on the structure and properties of CCGA was studied。 It is concluded that the smaller the elastic  modulus of the material in a low range, the better the performance of the test, the more suitable as a CCGA device of the solder column materials。

Key words: CCGA Finite element Structure optimization

目 录

摘要 Ⅰ

Abstract -Ⅱ

目录-Ⅲ

图清单-Ⅴ

表清单-Ⅵ

1 绪论 1

1。1 课题背景及研究目的和意义 1

1。2 国内外研究现状 1

1。3 本课题的主要研究内容 7

2 ANSYS 软件介绍 8

2。1 技术种类 8

2。2 开发应用 8

2。3 前处理 10

2。4 后处理