摘要：本论本主要研究无电源立体灯片封装工艺，制备出实物灯片。在灯片设计、封装过程中的固晶、焊线和封胶、光色性能控制及产品的性能检测方法及检测技术等方面进行研究，以便找到最好的方式方法及技术。具体为：探索其固晶工艺，焊线工艺和封胶工艺；探索适合交流高压LED测试方法，使用大积分球等光电测试系统测试其光通量，包括比较初态和稳态灯片双面发光时的光效，色温，色品坐标等相关参数以及以电压为变量光电参数的变化趋势。采用热学软件对LED灯片的散热进行模拟，制备出实物灯片，通过热成像或多通道温度测试仪对其热分布和温度进行表征，获得对比数据。41836

毕业论文关键词：LED；无电源发光；光学；电学；热学

Design and photoelectric Thermal Performance Analysis of No power LED chip

Abstract: The the main idea of the theory is about non-powered stereo slides packaging process to prepare a kind of slides. Study in light sheet design, packaging process in terms of solid crystal, wire and plastic closures, light color cost control and product performance testing methods and testing techniques, in order to find the best ways and techniques. Specifically: explore their craft solid crystal, wire and plastic closures process technology; explore suitable AC high voltage LED test methods, the use of large integrating sphere and other optical test system to test its luminous flux, comprising comparing the initial and steady double-sided light emitting time relevant parameters of luminous efficiency, color temperature, chromaticity coordinates and trends in the photovoltaic voltage variable parameters. Software using thermal heat LED lights to simulate sheet prepared in kind slides, it was characterized by thermal imaging or multi-channel temperature tester for its heat distribution and temperature, to obtain comparative data.

Keywords: LED; No power light; optical;electrical; thermal

目录

摘要 i

Abstract i

目录 ii

第一章 绪论 5

1.1  论文背景 5

1.2  课题的研究方法与步骤 5

1.3  课题的研究目的和意义 6

1.4 LED的概述 6

1.4.1 LED的发光原理 7

1.4.2 LED的优势 7

1.4.3 LED 的不足 8

第二章 无电源LED灯片概述 10

2.1 无电源 LED灯片的基本特性 10

2.2 无电源LED灯片的工作原理和结构 10

2.3 无电源LED灯片的应用 11

2.4.1 COB封装（Chip On Board）的介绍 11

2.4.2 陶瓷基板的的定义和性能[10] 12

2.4.3 陶瓷基板的的设计 13

第三章 无电源LED灯片的生产步骤 16

3.1 实验仪器的介绍 16

3.2 LED的主要光学性能参数 16

3.3无电源 LED灯片 的生产流程 19

3.3.1扩晶 19

3.3.2点胶和固晶 19

3.3.3 焊线