陶瓷球栅封装阵列CBGA焊点的热循环失效
毕业论文关键词：BGA 焊点 热循环失效
Title: Ceramic ball grid array package CBGA solder thermal cycling failure
Abstract:
BGA (all known as Ball Grid Array) That ball grid array package, widely used in integrated circuit components (such as: microprocessors, etc.) among bond with the substrate, high-end IC packaging has become a mainstream technology. Rear substrate manufactured by an array of spherical contacts as pins, solder metal spherical neatly arranged, can act as an integrated circuit I / O side of the printed circuit board (PCB) interconnected. Compared with the traditional foot-mount devices, BGA packaged devices having a pin number of large and small total surface damage, pin solid, high packing density, electrical properties, heat resistance also improved. On the production side, this package an array of simple production equipment, high yield, so widespread use. The main failure was due to the BGA solder joint failure caused by the failure of studies so for BGA solder joints is particularly important. In this paper, ceramic ball-grid array package thermal cycling solder a study.
Key words: BGA Joints Thermal Cycle Failure
目 录
1引言 1
1.1课题背景1
1.2国内外研究状3
2理论背景 5
2.1焊点的热循环失效5
2.2焊点材料5
2.3疲劳分析简述5
3建立模型 7
3.1零件建模7
3.2零件装配8
4模型计算 10
4.1导入模型，划分网格10
4.2设置材料，添加材料11
4.3添加约束12
4.4进行计算12
5结果分析13
5.1应力应变分析13
5.2寿命预测18
结论 22
致谢 23
参考文献24
1 引言（或绪论）
1.1 课题背景
1.1.1 BGA的定义
BGA全称Ball Grid Array，是一种基于集成电路上电子元器件和主板表面粘结的封装技术。随着集成电路的集成度越来越高，元器件引脚数量与日俱增。BGA与传统的针脚的显著区别就是用金属焊点取代了直接插入主板的针脚。是一种较为先进的封装技术。
1.1.2 BGA的分类
PBGA：基板材料为多层塑料（Plastic BGA）具体的材料有很多，例如：环氧树脂，酚醛树脂，聚录乙烯，硬工程塑料。层数一般为2~4层不等。实例：Pentium II、III、IV处理器与主板的封装。
CBGA：基板材料为陶瓷（Ceramic BGA）实例：Pentium I、II、Pentium Pro处理器与主板 的封装。
FCBGA:（ filp Chip BGA）基板材料为硬质多层基板。
TBGA:（Tape BGA）基板：基板材料为带状的单层或双层的PCB电路板，此基板的质地较软。
1.1.3 BGA的特点
BGA封装技术一出现，便为CPU，南北桥芯片等高密度，多功能，I/O端繁多的高性能电子器件与主板连接的提供了更加优化的封装方案。BGA的优势是在与传统的针脚式连接方式比较中凸显出来的。