摘要：　随着LED在芯片工艺、封装制程技术、器件材料等方面的快速发展，一种芯片尺寸级封装CSP（Chip Scale Package）技术应运而生，目前基于CSP光源的LED球泡灯在LED行业具有非常好的市场前景。本文针对基于CSP光源的LED 球泡灯封装工艺进行研究，设计CSP光源LED球泡灯的基本结构，制备出光效100lm/W左右，色温3000K左右实物球泡灯。用200-250mA电流和22V的电压去点亮CSP芯片和100mA电流和22V电压去点亮带散热器的CSP芯片，220V电压和50HZ交流电去点亮CSP球泡灯测试其光通量，光效，色温，色品坐标等相关参数，每间隔5分钟测一次，对得出的数据进行对比，得出结论。对其进行优化提出可靠的建议，制备出发光均匀，光通量高，可靠的产品。用22V的电压去点亮CSP芯片封装和13-15V的电压去点亮COB芯片，电流从150-400mA，每次间隔50mA测一次，对得出的光电参数进行对比分析，探讨芯片两种不同封装的区别。50050

    通过光电测试系统对其光学性能进行测试分析，并与模拟数据进行对比； 把带散热器的CSP芯片、铝基板作为散热器的CSP光源LED球泡灯和普通散热器的CSP球泡灯作为三个模型进行ProE建模，并通过热模拟软件FloEFD进行仿真模拟，分别得出其散热分布，通过热成像或多通道温度测试仪对其热分布和温度进行表征，通过两种方法，获得对比数据进行可靠的分析；探讨CSP球泡灯更适合哪种散热器。

毕业论文关键词：CSP封装；CSP球泡灯；COB封装；对比可靠分析；散热器

Abstract  With the rapid development of LED using in chip process, package process technology, device materials, a new type package technology ,CSP(chip scale package ) ,emerges in response to the times. The LED bulb lamp based on CSP light source, has a very good market prospects  in the LED industry currently. This assay  is based on CSP light source LED ball bubble lamp encapsulation process technology and has a detailed study about it . In this case study, the basic structure of CSP light source LED ball bubble lamp is designed, which means 100lm/W luminous efficiency, and  3000K color temperature. In experiment, 200-250mA current and 22V voltage is adopted to light CSP and 100mA current; voltage 22V is used to light CSP chip with the radiator; the voltage of 220V and 50Hz alternating current is to light CSP ball bubble lamp in order to  test  the luminous flux, luminous efficiency, color temperature, chromaticity coordinates and other related data for every 5minutes each time . After comparing  the obtained data, the final conclusion is made and the available suggestion on improvement will be given to create the reliable products with much more  uniform luminescence, higher luminous flux. With voltage 22V to light CSP chip package and 13-15V voltage light cob chip,and using the current from the 150-400mA, there will be tests within  a time interval of 50mA. Then  the comparative analysis will be made based on the gained photoelectric parameters derived and aims at the difference between two types of chip  package. 

    Optical test system test and analysis of data and optical properties compared with the analog data; As the DSP chip, the aluminum strip radiator with a radiator CSP LED light bulb and ordinary radiator CSP bulb as three ProE model,  three models were overheating FloEFD simulation software simulation, respectively, obtained its heat distribution,Performed using thermal imaging or multi channel temperature tester for its heat distribution and temperature tested by two methods, reliable analysis; Discussion CSP bulb which is more suitable for radiator.

Keywords: CSP packaging; CSP ball steep light; COB encapsulation; Reliable comparison analysis; The radiator

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